BIZON® Press-Fit Technology
Smart, high-performance and reliable connection solution.
BIZON® – contact: One principle for all sizes
Construction-related freedom, free material selection, adaptable
ALACsystems offers an innovative solder-free connection technology with BIZON® press-fit technology for the requirements of the automotive supply industry and industrial electronics. The press-fit techniques are a solder-free electromechanical connecting method, with which elastic workable or solid pins are pressed into metal coated circuit board holes with the aid of a pressing tool. At the points of contact between the pressing area of the pins and to the metal coated hole in the wall, a permanent gas-tight connection is therefore formed.
High current-carrying capacity
The important characteristic here is that the diagonal of the pin cross-section is greater than the diameter of the copper sleeve in the circuit board. The BIZON® Contact, as an elastic contact, offers the greatest possible cross-section in a circuit board hole with overriding contact characteristics. As a result, it is possible to handle several hundred ampere ranges with standard circuit boards. This has an important price advantage, particularly in the case of motor vehicle applications. The contact can be produced in every size and sheet-metal thickness, with free material selection. A unique feature is that, with the same production enginee-ring, both a non-detachable press contact and a detachable plug contact can be manufactured.
Our automotive products
for demanding applications
- Stamped contacts – overmolded or pressed in separately
- Male Multipoint blade connectors with circuit board plug connectors equipped with different pins – straight, bent, sealed
- Circuit board plug connector with different separations and different pole numbers
- Overmolded housing/hybrid component parts which offer special protection against e.g. liquids or gases
- Pin header: Pin contacts connected with a simple pin insulator
- High-current busbars for the power feed into the circuit board
Advantages
- Reliability (up to 30 times more reliable than an SMT solder joint)
- Space saving and optimum use of construction space
- Economic advantages in working process
- Simplification in processing
- Material compatibility: Compatibility with automotive specifications (e.g. IMDS, RoHS)
DIN EN IEC 60352-5 Hella-Standard, Siemens-Standard, ZF-Standard
Electrical and mechanical characteristics
- High current-carrying capacity with minimum space Requirement
- Four contact points through square Cross-section
- Sheet thickness from 0.2 mm to 2 mm possible
- Low pressing force
- High retention forces through cold welding
- Dismantling possible by mechanical squeezing
Force distribution and directing
into the circuit board
A standardized competition comparison with any current shows the advantage of the BIZON® contact. fig. left: BIZON®, fig. right: Competition
- Four symmetrically-distributed contact surfaces, far apart from each other and defined, mean proper contact pressure
- Four similar radial contact forces result in good self-centring and symmetrical support – the contact adapts to the hole
- No torque, no tangential movement and no bending in case of minimum hole
- Surface force distribution means no summing and no expansion of the circuit board
- Therefore no hazard exists for SMD elements nearby
Sheet(strip) thickness and hole table
Overview
| Sheet thickness | Pin dimensions | Finished hole PCB | smallest stamping pitch |
|---|---|---|---|
| 0.2 | 0.2 x 0.24 | 0.3 – 0.38 | 0.81 |
| 0.4 | 0.4 x 0.5 | 0.55 – 0.65 | 1.3 |
| 0.6 | 0.6 x 0.6 | 0.8 – 0.9 | 1.2 |
| 0.64 | 0.64 x 0.64 | 0.9 – 1.0 | 1.3 |
| 0.64 ¹ | 0.64 x 0.8 | 1.0 – 1.1 | 1.45 |
| 0.8 | 0.8 x 0.8 | 1.05 – 1.15 | 1.6 |
| 0.8 ¹ | 0.8 x 1.2 | 1.40 – 1.55 | 2.0 |
| 1.2 | 1.2 x 1.2 | 1.52 – 1.67 | 2.4 |
| 1.2 ¹ | 1.2 x 1.5 | 1.9 – 2.05 | 2.7 |
| 1.5 | 1.5 x 1.5 | 1.9 – 2.05 | 2.7 |
| 2.0 | 2.0 x 2.0 | 2.7 | 4.0 |
1
2
3
4
5
6
1
Sheet thickness 0.2
2
Sheet thickness 0.4
3
Sheet thickness 0.63
4
Sheet thickness 0.8
5
Sheet thickness 1.2
6
Sheet thickness 1.5
All dimensions in millimetres 1) The contact is adapted to historically standard, larger hole diameters.
Qualification
Feasibility analysis, development, manufacturing
In the phase of product development, we specify the significant influence parameters such as basic material, press-in zone geometry and surface coating, and then monitor these in the series. We advise and support our customers right from the beginning throughout the entire project phase. In the test laboratory, significant characteristic values according to DIN EN 60352-5 can be tested and validated. The inspection and measuring equipment required for that is available. Test circuit boards, or on request also your series circuit boards, are used for the test.
- Visual and dimension inspection
- Press-in and press-out force
- Microsection setting and assessment
- Forward resistance
- Rapid temperature cycling (temperature shock)
- Air-conditioning sequence (dry heat, refrigeration & moist, cyclical heat)
- Whisker test
- Etching techniques
For more information please visit bizon-kontakt.de or download our brochure.
